Materials

Datasheets

Lightweight

Epoxy resin system dedicated for lightweight structures.

Compatible with various high-performance fibers (carbon, glass…)

Applications

Features

  • Aerospace
  • Motorsport
  • Tg (dry) : 145 – 170°C
  • Curing Temperature (typical): 135°C

For more information, please contact us.

Low temperature cure

Epoxy resin system adapted for low curing temperature.

Compatible with various high-performance fibers (carbon, glass…)

Applications

Features

  • Marine
  • Industrial
  • Tg (dry) : 100 – 110°C
  • Curing Temperature (typical): 80°C

For more information, please contact us.

High performance

Epoxy resin system dedicated for stiff & strong structures.

Compatible with various high-performance fibers (carbon, glass…)

Applications

Features

  • Motorsports
  • Industrial
  • Tg (dry) : ~ 160°C
  • Curing temperature (typical): 165°C

For more information, please contact us.

Adhesive film

Epoxy based adhesive film compatible with all our prepreg resin systems.

Used to bond composite-composite, composite-foam or composite-honeycomb parts.

Low temperature cure and good flow properties.

Applications

Features

  • Aerospace
  • Motorsport
  • Tg (dry) : ~ 100°C
  • Curing temperature : 80 – 120°C

For more information, please contact us.

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